ESD/ESL SERIES
END-STACKABLE SMT TYPE

FEATURES

End stackable for standard 0.1" integrated circuit pitch.
Molded 0.3" integrated circuit packing outline allowing automatic insertion.
Smaller size makes better heat convection during PC board reflow wave soldering.
Top tape sealed to withstand wave soldering, board washing.
All plastics are UL 94V-0 grade fire retardant.
Twin contacts designed to ensure stable contact.
Gold plated contact to ensure low contact resistance and
Tin plated terminals to prevent contamination during soldering.

SPECIFICATIONS

1.ELECTRICAL

Contact rating
switching	25 mA, 24 VDC
non-switching	100 mA, 50 VDC
Contact resistance
initial	50 m Max.
after life test	100 m Max.
Insulation resistance	1000 M Min. at 100 VDC
Dielectric strength	500 VDC Min. for 60 seconds
Capacitance between adjacent switches 5 pF Max.

2.MECHANICAL

Temperature rating
operating	-25 to +70
storage	-40 to +85
Operation force	800g Max.
Mechanical life	2000 operations
Humidity	95%RH, 40 for 96 Hrs.
Vibration	Per MIL-STD-202F, method 204D
Solderability	after flux 2305 for 50.5 seconds, 95% coverage
Resistance to soldering Heat	2605 for 5 seconds.
Reflow soldering heat for SMT type (reference only)	reflow zone 2305 for 30 seconds