Reliability Test For Multilayer Chip

Item

Specification

Test Conditions

Operating
Temperature range

-25°C to +85°C
( -13°F to 185°F )

Storage
Temperature range

-40°C to +85°C
( -40°F to 185°F )
0 to +60°C ( 32°F to 140°F )
( in Tape and Reel packaging )

Soldering
Heat resistance

The chip should not crack,
more than 75% of the
terminal electrode should
be covered with solder.

Impedance: Within

20%
of the intial Value

Preheat: 120°C to 150°C ( 248°F to
320°F ) for 60 seconds.
Solder: H63A ( eutectic solder )
Solder temperature: 260

5°C ( 500

41°F)
Flux: Rosin
Dip time: 10

0.5 seconds

Solderability

More than 90% of the
terminal electrode
should be covered with
new solder.

Preheat: 120°C to 150°C ( 248°F to
320°F ) for 60 seconds.
Solder : H63A ( eutectic solder )
Solder temperature: 230°C

5°C ( 446°F

9°F)
Flux: Rosin
Dip time: 4

1 seconds

Terminal strength

The terminal electrode
and the ferrite should
not be damaged by the
force applied on the
right conditions.

Bending strength

The ferrite should not be
damaged by force
applied on the right.
conditions.

Item

Specification

Test conditions

Thermal shock

Per EFZ Series
Impedance should be
within

20% of the
initial value

Per EF Series
No mechanical damage
Inductance should be
within 5% of the initial
value and Q shall be
within 30% of the
initial value.

Temperature: -40°C, +85°C for 30 minutes each
Cycle: 100 cycles
Measurement: After placing for 24 hours Min.

High temperature
Resistance

Temperature: 85

2° C
Testing time: 1008

12 hours
Measurement: After placing for 24 hours Min.

Humidity resistance

Humidity: 90 to 95% RH
Temperature: 40

2° C
Testing time: 1008

12 hours
Measurement: After placing for 24 hours Min.

Flexure strength

The terminal electrode
and the ferrite must
not be damaged by
the forces applied
on the right conditions.

Unit: mm (inch)